Tangential grinding | O.M.B. Italy

Tangential grinding

Tangential grinding is a mechanical finishing process for chip removal.
Through the tangential grinding process it is possible to obtain a wide range of surfaces: flat, shoulders and grooves.
Tangential grinding processes are carried out by a tool called grindstone, which has micro-cutters of industrial diamond fixed together with adhesive material.
The tangential grinding process is achieved by rotary movement of the cutting grindstone in combination with a feeding motion, which can be engraved to the grindstone or to the workpiece.
The micro-cutters of the grindstone penetrate the material and remove the excessive parts (machining allowance) creating chips which are considered a waste material of the operation.